Market participants believe that Himax is an important augmented reality component supplier for Microsoft HoloLens, so the author is also closely watching the company's latest developments.
Analysts who are doing the same thing believe that Microsoft has reduced the number of orders for Qijing Optoelectronics because the new HoloLens may not begin production until the second half of 2017.
In the release of the latest financial statements, the executive director of Qijing Optoelectronics confirmed that the company's LCOS and WLO product line sales will decline in the fourth quarter of this year, and will continue into the next few quarters of 2017, due to the wonders Optoelectronics "Major AR customers are shifting their focus to the development of next-generation devices." "Primary AR customers" should refer to Microsoft.
Whether Microsoft just wants to guide other Windows OEMs is not 100% certain, but it seems that the company wants to stand out in the high-end market and may integrate some of the patented technologies already disclosed in HoloLens. . At the same time, they also hope that other OEMs will create devices that support Windows Holographic to create a complete ecosystem. Of course, this needs to be built in a large enough market to accommodate a group of companies that are about to enter the field.
What is a rigid-flex PCB?
Printed circuit boards can be divided into rigid printed boards and flexible printed boards according to their production materials. Rigid printed boards include phenolic paper laminates, epoxy paper laminates, polyester glass mat laminates and epoxy glass cloth laminates. The flexible printed circuit board is also called a flexible printed circuit board or FPC. The flexible circuit board is a circuit board with high reliability and high flexibility made of polyimide or polyester film. The circuit board has good heat dissipation, can be bent, folded, curled, and can be moved and stretched freely in a three-dimensional space. FPC can be used to reduce the volume, achieve lighter, miniaturized, and thinner, so as to realize the integration of components and wire connections. FPC is widely used in electronic computers, communications, aerospace, home appliances and other industries.
Features of flexible circuit board:
(1) FPC is small in size and light in weight.
(2) FPC can move, bend and twist.
(3) FPC has excellent electrical properties, dielectric properties and heat resistance.
(4) FPC has high assembly reliability and assembly operability.
(5) FPC can install three connections.
(6) FPC is conducive to thermal diffusion.
(7) Low cost.
(8) The continuity of processing.
Flexible circuit board product characteristics:
A flexible board is a printed circuit board made of a flexible insulating substrate and has many advantages that a rigid printed circuit board does not have.
The product is small in size and light in weight, greatly reducing the volume of the device, and is suitable for the needs of electronic products to develop in the direction of high density, miniaturization, light weight, thinness, and high reliability. It has high flexibility and can be freely bent, wound, twisted, folded and three-dimensional wiring. It can be arbitrarily arranged and changed according to the space layout requirements, and can be moved and expanded in a three-dimensional space to realize the integration of component assembly and wiring.
It has excellent electrical properties, high temperature resistance and flame retardant properties. Stable chemical changes, good stability and high reliability. It has higher assembly reliability, provides convenience for circuit design, can greatly reduce the assembly workload, and is easy to ensure the performance of the circuit, thereby reducing the cost of the whole machine. By using reinforcing materials to increase its strength, to obtain additional mechanical stability. The design of the combination of soft and hard also makes up for the slight deficiency of the flexible substrate in the load-bearing capacity of the component to a certain extent.
It can be high density. For more than one hundred years, with the improvement of integrated circuit integration and the progress of mounting technology, the high density of printed boards has been developed.
High reliability. Through a series of inspections, tests and aging tests, the PCB can work reliably for a long time (usually 20 years).
Can be designed. For PCB performance (electrical, physical, chemical, mechanical, etc.) requirements, printed board design can be achieved through design standardization, standardization, etc., with short time and high efficiency.
Manufacturability. With modern management, standardized, large-scale (quantitative) and automated production can be carried out to ensure the consistency of product quality.
Testability. A relatively complete test method, test standard, various test equipment and instruments have been established to test and evaluate the eligibility and service life of PCB products.
After electronic equipment adopts printed boards, due to the consistency of similar printed boards, manual wiring errors can be avoided, and Electronic Components can be automatically inserted or installed, automatic welding, automatic detection, ensuring the quality of electronic equipment, improving labor productivity, and reducing costs . Easy to maintain.
Rigid circuit boards and flexible circuit boards have both similarities and differences. For flexible circuit boards, rigid circuit boards are more widely used. Since rigid circuit boards appeared earlier, most of the design elements of rigid circuit boards have been applied to the design of flexible circuit boards. What is the difference between the flexible circuit board and the previous one?
1. The current-carrying capacity of the wire: Compared with the rigid circuit board, the flexible circuit board has poor heat dissipation performance, and sufficient line width must be provided. Due to the heat dissipation problem of the flexible circuit board, the additional width or
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