Where do flip-chip manufacturers go?

[Source: Gaogong LED's "LED Good Products" December issue (total 60th issue) Wen|Yang Jinglin] Following the "LED Good Products" magazine September issue analysis of the current major process of flip-chip technology, October issue analysis of the flip-chip process The various problems faced, the November issue to discuss the market status and future direction of flip-chip technology, three-dimensional in-depth coverage of flip-chip technology and technology to meet everyone's "curiosity" of flip-chip technology.

In fact, flip-chip technology has been used in the semiconductor industry more than 20 years ago, but the flip-chip concept in the field of LED packaging was only introduced in 2008. At the time of this concept, there were very few companies responding. Nowadays, the industry has mentioned that flip-flops are almost unknown.

With the continuous advancement of technology, the various processes of flip-chip are undergoing profound changes, which in turn lead to different levels of change and innovation in the implementation of various basic materials and equipment. This reporter will focus on the analysis and discussion of the problems of flip-chip equipment.

<br> <br> improved equipment in power current, encapsulation packaging manufacturers use mainly in the following two: one is the use of gold-tin eutectic alloy, bonded directly to welding (hereinafter referred to as "solder alloy"); another The eutectic method (hereinafter referred to as "reflow soldering") in which reflow soldering is added by adding a flux (mainly solder paste).

According to the relevant personnel of Cuitao Automation, the eutectic alloy process used for traditional semiconductors in alloy welding requires close cooperation between high temperature and ultrasonic waves, and requires reliable welding to achieve the work of flip-chip alloy welding. However, at present, the technical system of such equipment is obviously immature and costly. At present, our equipment is also unable to meet the technical requirements of flip-chip packaging.

According to the reporter, this welding technology needs to be completed in a high temperature environment of 300 degrees. The packaging method is completely different from the traditional solid crystal method, which leads to the unsatisfactory flip-chip equipment introduced by many domestic equipment manufacturers. According to the reporter's understanding, most of the flip-chip alloy welding processes on the market today are foreign equipment, and domestic equipment manufacturers still have certain technical thresholds for eutectic alloy welding.

He Yunbo, general manager of Dazu Optoelectronics, said that "the change of flip-chip method, combined with the various forms of flip-chip technology, makes the flip-chip equipment required by packaging manufacturers different. It is unlikely to meet this demand in the short term." .

At the same time, with the sharp decline in the price of LED packaging devices, the company's gross profit margin continued to fall, which also allowed many companies to maintain a conservative attitude in the investment of new equipment, especially in the context of high-priced imported equipment and domestic equipment. Unusual caution. In addition, some companies have come to the next level, choosing domestic equipment or improving on existing equipment.

The reporter visited and learned that for the flip-chip technology using solder paste reflow soldering, most companies choose to improve on the existing formal packaging equipment to make it basically meet the packaging manufacturer's demand for flip-chip technology. If the original equipment is adjusted from 15K/hour or 20K/hour to 10K/hour, the speed will be slower and the accuracy will be higher to meet the needs of flip-chip.

Ye Guangkai, Chairman of Guangmai Electronics, said, “Many companies, including us, are using flip-chip equipment that has been modified with solder paste to cure reflow soldering. Although there are smaller holes in the middle of the chip, it is not necessarily It can be completely filled, but this does not affect the overall thermal conductivity of the device, and the yield and quality of the product can be guaranteed."

Many difficulties to be solved <br> <br> flip compared to the suits, the difference in the whole process is not large, but the flip-related equipment used there is different from being installed. Currently, equipment for flip-chip packaging includes a die bonder, a duster, a die top machine, a laser cutting machine, and a back-end beam splitter.

Among them, the solid crystal machine plays an important role in the entire flip-chip process. ASM's solid crystal machine has a high precision at the bottom of the chip, and the connection is just right, so that there is no void between the whole chip and the bracket, and the heat conduction effect is good, so it has advantages in the market.

However, Ye Guangkai pointed out that although the original flip-chip is a solid crystal machine produced by ASM, the current packaging industry products have low profit margins, long equipment recycling cost cycle, and short-term speed and efficiency in the flip-chip packaging process. As a result, the current flip-chip packaging manufacturers have not purchased too much ASM crystallizer. At the same time, the expensive price of ASM die-casting machines has also discouraged many packaging manufacturers, and they have more choices to improve on existing equipment.

Of course, many people will question whether the existing equipment can be improved to meet the solder paste reflow process requirements. The insiders explained that after the solder paste is cured, tiny voids can be tolerated and accepted without affecting the overall thermal conductivity of the product. And at present, many packaging manufacturers still use flip-chip bonding technology to produce flip-chip devices.

Domestic powder spraying machines have gradually emerged in the market, but the effect is not ideal. "Imported powder spraying machine works well, but the price is high; domestic powder spraying machine is relatively cheap, but the accuracy is not as accurate as imported equipment." Ye Guangkai introduced. The domestic powder spraying machine is more suitable for enterprises that produce a large number of standard product stocks, and different standard products can be sold separately.

As soon as possible, the domestically produced die-topping machine, which is simple in operation and inexpensive, is urgently needed by current packaging manufacturers. Dispensing die top machines are only suitable for use in the production of samples and small quantities of products. At present, the die-topping machines used for mass production are basically not available in China, and for the imported die-top machines that are moving millions, the packaging manufacturers are slightly "squeaky".

Considering that the current flip-package products are not mass-produced and the market is uncertain, some companies have chosen to buy used dusters and die-top machines from abroad for production.

The laser cutting machine and the beam splitter used in the final assembly are obviously much easier, and the packaging manufacturers can completely use the domestic equipment. According to industry insiders, the precision of the domestic flip-chip laser cutting machine is already high enough to meet the needs of customers, and the spectro-striping machine can be improved on the basis of domestically produced equipment to fully satisfy the flip-chip process.

It is true that if the flip-chip package is to be completely replaced on the packaged equipment, all the imported equipment with high precision is used, the initial investment is too large, and the medium-term recovery cost is difficult and long. Whether the market situation changes in the later stage is still unknown. It is better to say that listed companies with financial resources are not so free and easy for small and medium-sized enterprises with insufficient funds.

The Road Ahead unknown <br> <br> flip compared dress does have advantages, but the promotion of flip-products, the biggest obstacle is the high prices. Although the gold line is missing, the reduction of the gold line has little effect on reducing the price of flip-chip products. Secondly, the introduction of flip-chip technology has not made a big breakthrough and improvement in guiding heat dissipation.

Cui Tao related personnel introduced, "The current flip-chip technology market is not mature, and the future market trend is uncertain. Although many equipment manufacturers are paying close attention to the flip-chip market, but due to the influence of many uncertain factors, we have not made a big deal for the time being. The investment in research and development of flip-chip equipment."

Some industry personnel mentioned that the LED flip-chip package compared with the solid crystal wire bonding mode, which will probably account for 16% of the market share by 2020, while the solid crystal wire accounts for 84%. From this point of view, flip-chip future may become a segment of the LED packaging industry.

“So, the current industry's use of existing equipment for improvement for flip-chip packaging has become the first choice for flip-chip packaging equipment.” Ye Guangkai believes that the use of improved equipment in the industry is very reasonable.

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