As is known to all, last year, due to the rising prices of chemical raw materials and the stabilization of the LED industry, the price of LED packaging adhesives began to fall in the second half of the year, and the market scale began to increase gradually. However, most of these companies are not involved in the field of LED packaging adhesives. With its core technology, the low-end packaging rubber market is still highly competitive.
The high-end packaging adhesive with excellent performance is controlled by foreign companies and a small number of domestic companies with strong technical strength. With the rapid development of packaging technology, more stringent requirements are imposed on the performance of packaging adhesives. Therefore, domestic packaging rubber manufacturers need to closely follow the development of packaging technology and chip technology to adjust their own products, in order to ensure that enterprises in the big waves.
Shenzhen Chenri Technology Co., Ltd. (hereinafter referred to as “Morning Technologyâ€), as a national high-tech enterprise in the field of electronic fine chemicals, and a new third-list listed company, closely followed the market demand and successfully developed a filament in January 2017. New technology for rubber, and has obtained relevant invention patents.
It is understood that the newly developed LED filament encapsulant is a one-component high thixotropic silica gel with good formability, high transparency, strong adhesion and easy operation. At the same time, the technology has optical properties such as high brightness, high light efficiency and low light decay. After the product is cured, it can be cracked, yellowed and hardened after being aged for a long time at 300 °C.
In addition, the packaged filament can be ignited for 500 hours at high temperature to ensure no dead light, the light decay is only 5% or less, and the reliability is high. The filament adhesive can be used for high current filament package of 20mA or more.
LED filament encapsulant is a self-developed product of Chenri Technology. Its core materials include resin and tackifier. All of them are laboratory synthesis, especially the preparation of high-efficiency heat-resistant resin. It has achieved key technological breakthroughs, making Chenri Technology The filament adhesive is superior to the Japanese imported brand of filament adhesive in heat aging resistance, and is in a leading position in the industry.
According to Qian Xuexing, general manager of Morning Technology, "The newly developed this filament adhesive is upgraded on the basis of the original filament adhesive. In addition to the significant improvement in optical performance and aging reliability, the formability of the product. The safety of use has also been greatly improved, which largely solves the problems of flow glue and collapse which are easy to occur in the past process of filament glue."
Of course, since the core material is self-developed and produced by Chenri Technology, the cost advantage of the product is obvious and the cost performance is high. At present, this LED filament adhesive can be used in both small current filament packages and high current filament packages, and has a wide range of applications. Compared with imported filament glue, the company's filament glue can effectively reduce costs for customers.
It is worth mentioning that since the filament rubber technology has been introduced to the market, it has been well received by customers. The following are some of the customer's evaluation of the technology:
1. The filament rubber products in the morning are stable in application and have a wide range of use;
2, the quality of LED filament glue products in the morning, the price is cheap, cost-effective;
3, filament rubber single component products are easy to operate, technology and logistics services in a timely manner.
Based on the innovative technology of filament rubber technology, it also has strong market competitiveness after being introduced to the market. The company decided to bring the filament rubber to compete for the 2017 “Technology Innovation Awardâ€.
About Morning Technology
Shenzhen Chenri Technology Co., Ltd. was established in 2004. The company has been committed to the research, development, production and sales of electronic soldering materials and semiconductor packaging materials. The company has a group of doctors and masters with many years of research and development experience, constantly exploring and opening new ideas. Technological development of materials. Our company has successfully applied for more than a dozen national patents. The company has won the title of Shenzhen High-tech Enterprise and Guangdong Private Technology Enterprise.
From 2009 to 2010, we successfully developed a solid crystal solder paste with a thermal conductivity of 35-64W/mK, which can meet the needs of high-power LED chips and other chip packages with high heat dissipation requirements, and can completely replace conductive silver. The glue solves the heat dissipation problem of the high-power silver plastic package, improves the service life of the high-power LED and the stability of the output, and can also enhance the bonding strength of the chip and greatly reduce the packaging cost. At the same time, the company also specializes in the research and development and production of high-power organic silica gel. The main products and models are: phosphor powder, integrated glue, MOLDING glue, lens filling glue and patch glue. The company always has high quality, high cost performance and comprehensive and thoughtful. Our services and solutions to our customers, customer satisfaction is our biggest goal!
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