Intersil, a global leader in high-performance analog and mixed-signal semiconductor design and manufacturing, has recently introduced the ISL8200MM, an advanced DC/DC power module tailored for demanding defense and avionics applications. This new version of the groundbreaking ISL8200M is specifically designed to meet the rigorous standards of military-grade environments.
The ISL8200MM power module complies with the U.S. Defense Supply Center (DSCC) VID V62/10608 specifications, ensuring reliable performance across extreme temperature ranges from -55°C to +125°C. It uses tin-lead materials to maximize long-term reliability, and each unit comes with full traceability through date/tracking code distribution. Intersil also provides enhanced process change notifications to keep customers informed of any modifications that may affect performance or compatibility.
This compact power solution integrates a complete switch-mode power supply into a single package, making it ideal for use in defense communications systems, radar, sonar, ground vehicles, and smart regulatory applications. Its QFN package features extended leads for easier pin commissioning and solder joint verification, while its slim 2.2mm thickness allows it to be mounted on the underside of PCBs alongside other thin components.
The ISL8200MM utilizes Intersil's patented current-sharing architecture, which significantly reduces noise sensitivity when multiple modules are used in parallel. This design minimizes the need for complex PCB layouts and enhances system stability. The module includes nearly all the necessary components for a plug-and-play solution, replacing up to 40 external parts and reducing the overall power management footprint.
With a 23-lead 15 mm x 15 mm QFN package featuring a large thermal pad on the bottom, the ISL8200MM supports an output power rating of up to 60 watts. Internal high-power components such as power MOSFETs and inductors are directly soldered to the thermal pad, enabling efficient heat dissipation to the PCB. Using a thermal via on the PCB, the typical thermal resistance (θ JA) is only 13°C/W, allowing for effective cooling without the need for airflow.
This combination of high integration, robust design, and excellent thermal performance makes the ISL8200MM a powerful and reliable choice for mission-critical defense and aerospace systems.
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