Intersil, a global leader in high-performance analog and mixed-signal semiconductor design and manufacturing, has introduced the ISL8200MM, the latest version of its groundbreaking DC/DC power module tailored for demanding defense and avionics applications. This military-grade power solution is designed to meet the stringent requirements of the U.S. Defense Supply Center (DSCC) VID V62/10608 specification.
The ISL8200MM is a complete switch-mode power supply in a single package, capable of operating reliably across an extreme temperature range of -55°C to +125°C. It uses tin-lead materials to ensure long-term reliability and comes with full traceability through date/tracking code distribution. Intersil also provides enhanced process change notifications to support consistent quality and performance.
With its QFN package featuring extended leads, the ISL8200MM offers flexibility for parallel load current scalability and is well-suited for use in defense communications systems, radar, sonar, ground vehicles, and smart regulatory applications. The module incorporates Intersil's patented current-sharing architecture, which minimizes noise sensitivity when multiple modules are used together, making it ideal for complex PCB layouts.
This highly integrated power module replaces up to 40 external components, significantly simplifying the design process and reducing the overall power management footprint. Its 23-lead 15mm x 15mm QFN package includes a large thermal pad on the bottom, enabling efficient heat dissipation and supporting an output power rating of up to 60 watts.
Internal high-power components such as power MOSFETs and inductors are directly soldered to the thermal pad, ensuring optimal thermal transfer from the module to the PCB. With a typical thermal resistance (θ JA) of just 13°C/W using thermal vias on the PCB, airflow is typically not required, further enhancing system efficiency.
The QFN package also features exposed leads around the edges, allowing for easier pin commissioning and solder joint verification. With a compact height of only 2.2mm, the ISL8200MM can be mounted on the underside of the PCB alongside other thin components, offering greater design flexibility and space savings.
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