The core part of the LED is the PN junction. The injected electrons and holes convert the electrical energy directly into light energy when they are combined in the PN junction, but not all converted light energy can be emitted outside the LED, it will be in the PN junction and ring. Oxygen resin/silica gel is converted into thermal energy by the absorption sheet. This thermal energy has great side effects on the lamp. If it cannot be effectively dissipated, the internal temperature of the LED will increase. The higher the temperature, the lower the luminous efficiency of the LED, and the shorter the life of the LED. In severe cases, LED chips will fail immediately, so heat dissipation is still a huge obstacle to high-power LED applications.
Existing cooling technology
The existing heat dissipation technology 101 is a heat dissipating aluminum profile; 102 is a thermal silica gel gasket/silicone grease; 103-106 is an aluminum substrate , wherein 103 is an aluminum plate, 104 is an insulating layer, 105 is a copper layer, and 106 is a solder resist layer 201. 204 constitutes an LED lamp, wherein 201 is an electrode, 202 is an LED base, 203 is a PN junction of the LED, 204 is a silica gel, and then the solder is soldered to the copper layer of the aluminum substrate using a solder paste as shown by a black arrow in FIG. The heat generated by the PN junction passes through the LED base, a solder paste layer, a copper layer, an insulating layer, an aluminum plate, a thermal conductive silicone gasket, a silicone grease, and a heat dissipating aluminum profile, which are emitted in the air, thereby completing the heat dissipation process.
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