STMicroelectronics Selected as the World's Best Chip Design Company by Gary Smith

According to reports from Gary Smith EDA, STMicroelectronics (ST), a leading global semiconductor supplier and IC design and solution provider, has been selected by Gary Smith EDA as one of the world's top four semiconductor design companies across multiple electronic applications. one. Gary Smith EDA is a world-renowned electronic design automation (EDA), electronic system leve (ESL) design, and related technology market intelligence and consulting services company.

Founder and Chief Analyst Gary Smith praised STMicroelectronics for its industry-leading electronic system-level design capabilities, deep know-how, and computer-aided design (CAD) teams for the semiconductor design industry. Contributions. Gary Smith, a respected senior chip design market analyst, said: “Today many of the design tools and methods we use are created and pioneered by STMicroelectronics. The ST design team is developing electronics. The leading edge in system-level design methods is worth praising the wafer design industry."

Philippe Magarshack, Vice President of Central CAD and Design Solutions at STMicroelectronics, said: “Gary Smith has extensive experience in the wafer design and evaluation industry. His views and opinions are respected and recognized by the global semiconductor industry. The report further demonstrates the Semiconductor's design-focused corporate strategy, focused product design allows us to compete for competitive advantages and strengthen our commitment to integrating superior design capabilities and manufacturing facilities to provide superior products to our customers."

STMicroelectronics has realized the requirements of system-level design for the optimization of the virtual platform architecture, system verification, and software development. It has taken the lead in the evolution to the open standards of System C and IP XACT, thus enabling the realization of the intellectual property rights module in the system-on-chip packaging process. interoperability.

ST's design capabilities cover a wide range of semiconductor technology areas including logic circuits, memory, MEMS, power semiconductors, logic power combo elements, and wafer level design, software, flexibility, tools, and methods. STMicroelectronics' system-on-chip ESL reference design process, through authoritative certification, can accelerate the development of a new generation of highly integrated, low-power and complex wafers. In addition, the company's manufacturing capabilities and close cooperation with foundries and back-end packaging and measurement professionals bring great flexibility to optimize the entire wafer design and development process.

Through the establishment of technology centers in various regions of the world and cooperation with industry and academia, STMicroelectronics will continue to lead the semiconductor R&D and innovation.