SOPC, English full name is System On a Programmable Chip, Chinese means programmable system-on-chip. Programmatic logic is used to place the entire system on a piece of silicon called SOPC. Programmable System-on-Chip (SOPC) is a special embedded system that uses programmable logic technology to place the entire system on a piece of silicon for embedded systems research and electronic information processing. First of all, it is a system-on-a-chip (SOC), which is the main logic function of the whole system by a single chip. Secondly, it is a programmable system with flexible design, can be reduced, scalable, upgradeable, and has hardware and software in the system. Programmable features. It can be said that SOPC is the result of the fusion of PLD and SOC technology.
What are the characteristics of SOPC?
SOPC combines the advantages of SOC, PLD, and FPGA. It generally has the following basic features: (1) at least one embedded processor core; (2) small-capacity on-chip high-speed RAM resources; and (3) rich IP Core resources. (4) sufficient on-chip programmable logic resources; (5) processor debug interface and FPGA programming interface; (6) may include partially programmable analog circuits; (7) single-chip, low-power, micro-package .
Comparison of types and indicators of SOPC technology solutions
Option 1 : SOPC system based on FPGA embedded IP hard core
This solution refers to pre-implanting the processor in the FPGA. The most commonly used devices are ARM 32-bit IP processor cores.
Option 2 : SOPC system based on FPGA embedded IP soft core
The IP soft core processor can effectively overcome the above shortcomings: The most representative soft core processors are Altera's Nios II core and Xilinx's MicroBlaze core. In particular, the Nios II core can solve the above five problems well.
Option 3 : SOPC system based on HardCopy technology
HardCopy is to use the original FPGA development tools to convert the SOPC system successfully implemented on the FPGA device directly to the ASIC through a specific technology, thereby overcoming the common problems in the traditional ASIC design.
The future of SOPC
SOPC is the result of the convergence of PLD and ASIC technology. At present, the 0.13-micron ASIC product is still very expensive to manufacture. On the contrary, the SOPC chip with integrated hard or soft core CPU, DSP, memory, peripheral I/O and programmable logic is in use. There is a great advantage in flexibility and price. SOPC is known as "the future of the semiconductor industry."
HDI is the English abbreviation for High Density Interconnector. High-density interconnect (HDI) manufacturing is one of the fastest growing areas in the printed circuit board industry. From the first 32-bit computer from HP in 1985 to the large client server with 36 sequential multi-layer printed boards and stacked micro-vias, HDI/mini via technology is undoubtedly the future PCB architecture. Smaller ASICs and FPGAs with smaller device spacing, I/O pins, and embedded passives have shorter rise times and higher frequencies, all of which require smaller PCB feature sizes, which drives Strong demand for HDI/mini vias.
HDI process
First-order process: 1+N+1
Second-order process: 2+N+2
Third-order process: 3+N+3
Fourth-order process: 4+N+4
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